Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

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dc.contributor.authorSalem, Thamer Khalif
dc.contributor.authorKhosroshahi, Ferina Saati
dc.contributor.authorArık, Mehmet
dc.contributor.authorHamdan, Mohammad Omar
dc.contributor.authorBudaklı, Mete
dc.date.accessioned2021-01-08T21:51:23Z
dc.date.available2021-01-08T21:51:23Z
dc.date.issued2019
dc.departmentTAÜ, Mühendislik Fakültesi, Makine Mühendisliği Bölümüen_US
dc.descriptionBUDAKLI, Mete/0000-0003-1721-1245; Hamdan, Mohammad O/0000-0003-0468-0309;en_US
dc.descriptionWOS:000456822600001en_US
dc.description.abstractThermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in compared with conventional heat pipe. Accordingly, reduction of approximately 50% is achieved for both embedded PCB prototypes.
dc.description.sponsorshipTurkish Ministry of Science and TechnologyMinistry of Science, Industry & Technology - Turkey [01464.STZ.2012-2]; Istanbul Development AgencyTurkiye Cumhuriyeti Kalkinma Bakanligi [ISTKABIL26, ISTKATR10/15/YNK/0029]; FARBA Corporation
dc.description.sponsorshipThe funding for this project was provided by the Turkish Ministry of Science and Technology under the grant number 01464.STZ.2012-2. This work was supported by the Istanbul Development Agency under the contract number ISTKABIL26 and ISTKATR10/15/YNK/0029. The authors would like to thank FARBA Corporation for their support in building the experimental setup.
dc.identifier.doi10.1080/08916152.2017.1397818
dc.identifier.endpage13en_US
dc.identifier.issn0891-6152
dc.identifier.issn1521-0480
dc.identifier.issue1en_US
dc.identifier.scopus2-s2.0-85035078973
dc.identifier.scopusqualityQ1
dc.identifier.startpage1en_US
dc.identifier.urihttp://doi.org/10.1080/08916152.2017.1397818
dc.identifier.urihttps://hdl.handle.net/20.500.12846/204
dc.identifier.volume32en_US
dc.identifier.wosWOS:000456822600001
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthorBudaklı, Mete
dc.language.isoen
dc.publisherTaylor & Francis Inc
dc.relation.ispartofExperimental Heat Transfer
dc.relation.publicationcategoryother
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.subjectHeat Pipeen_US
dc.subjectEmbedded Heat Pipeen_US
dc.subjectThermal Conductivityen_US
dc.subjectPrinted Circuit Boarden_US
dc.subjectElectronics Coolingen_US
dc.titleNumerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications
dc.typeReview Article

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WoS İndeksli Yayınlar Koleksiyonu
Makine Mühendisliği Bölümü Koleksiyonu
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