Ara
Toplam kayıt 3, listelenen: 1-3
Investigating the effects of post-mold cure on warpage in electronic packaging processes
(Türk-Alman Üniversitesi Fen Bilimler Enstitüsü, 2023)
Post-mold Cure ist ein häufig angewandtes Verfahren im Bereich Electronic
Packaging, bei dem duromere Teile nach der Formgebung erneut erhöhten
Temperaturen ausgesetzt werden, um eine höhere Vernetzungsdichte und damit ...
Additive manufacturing with metallic powder materials-development of a strategic material qualification methodology for electron beam powder bed fusion
(Türk-Alman Üniversitesi Fen Bilimler Enstitüsü, 2023)
Since the maturity level of the metal powder bed fusion (PBF) additive manufacturing (AM)
technologies have already become suitable to produce complex net shape parts, the need for
metal powders in AM industry is ...
Investigation of the bonding mechanisms of aluminum chips during SPD-and FAST-based solid-state recycling processes
(Türk-Alman Üniversitesi Fen Bilimler Enstitüsü, 2023)
Considering the reduction of resources and environmental concerns, the recycling of aluminum
alloys is gaining more importance day by day. In this context, especially in light of the recycling
of aluminum chips, which ...