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dc.contributor.authorTarçın, Gökberk
dc.contributor.authorSaygın, Alper
dc.contributor.authorMuslu, Mete
dc.contributor.authorBudaklı, Mete
dc.contributor.authorArık, Mehmet
dc.date.accessioned2021-01-08T21:51:30Z
dc.date.available2021-01-08T21:51:30Z
dc.date.issued2020
dc.identifier.isbn9781728197647
dc.identifier.issn1936-3958
dc.identifier.urihttps://doi.org/10.1109/ITherm45881.2020.9190588
dc.identifier.urihttps://hdl.handle.net/20.500.12846/319
dc.description19th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2020, 21 July 2020 through 23 July 2020, , 163015en_US
dc.description.abstractSince many industrial applications require heat treatment processes or validation tests under certain ambient temperatures, thermal design is a key issue to be considered in order to ensure fast heating and cooling capabilities. Although most industrial furnaces provide the required isothermal conditions for various test applications or calibrations, a number of them does not provide rapid heating and cooling inside a closed system and the thermal equilibrium over different regions of the system are not satisfied as intended. This brings a number of challenges for the performance test of most electronics, which are affected by ambient temperatures, such as LEDs, lasers and transistors. Particularly, a test environment that can quickly and accurately adjust a uniformly distributed isothermal domain can be useful for many electronic components in order to test their performance at preselected ambient temperatures. In such systems, the design parameters have to be adjusted depending on the desired conditions. In fact, the design of those systems has to be planned in detail to achieve a system working fast and accurate, which shall contribute to reduction in operating time. Therefore, this study focuses on proposing a new approach to the development of a high-performance and high-resolution heating and cooling chamber used in a junction temperature measurement of light emitting diodes (LEDs). The major objective thereby is to achieve high heating and cooling rates of a controlled chamber that satisfies thermal conditions at a user defined temperature interval between 20°C and 80°C. Therefore, material properties and geometrical dimensions, power requirements and cooling performances of the chamber are analyzed as major design parameters. Numerical models are created for various design options, and simulations are performed for various working conditions under certain design constraints. The relationships between design parameters are determined. A final design is proposed that is able to reduce measurement time of photonic components at a temperature uniformity of less than + 0.5 °C. © 2020 IEEE.en_US
dc.description.sponsorship217M357 Türkiye Bilimsel ve Teknolojik Araştirma Kurumu, TÜBITAKen_US
dc.description.sponsorshipThis work has been funded by the Scientific and Technological Research Council of Turkey (TÜBİTAK), research Grant No. 217M357. Authors also thank to EVATEG Center at Ozyegin University for allowing the use of the infrastructure.en_US
dc.language.isoengen_US
dc.publisherIEEE Computer Societyen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectForward voltage methoden_US
dc.subjectJunction temperature measurementen_US
dc.subjectLight Emitting Diodesen_US
dc.subjectPhotonicsen_US
dc.subjectThermal designen_US
dc.titleRapid heating and cooling chamber for a photonics junction measurement systemen_US
dc.typeconferenceObjecten_US
dc.relation.journalInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERMen_US
dc.identifier.volume2020-Julyen_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.contributor.departmentTAÜ, Mühendislik Fakültesi, Makine Mühendisliği Bölümüen_US
dc.contributor.institutionauthorBudaklı, Mete
dc.identifier.doi10.1109/ITherm45881.2020.9190588
dc.identifier.startpage267en_US
dc.identifier.endpage275en_US


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